CYCLIC PLASTIC BEHAVIOUR OF UFG COPPER UNDER CONTROLLED STRESS AND STRAIN LOADING

Lucie Navrátilová, Karel Obrtlík, Ludvík Kunz

Abstract


The influence of stress- and strain-controlled loading on microstructure and cyclic plastic behaviour of ultrafine-grained copper prepared by equal channel angular pressing was examined. The stability of microstructure is a characteristic feature for stress-controlled test whereas grain coarsening and development of bimodal structure was observed after plastic strain-controlled tests. An attempt to explain the observed behaviour was made.

Keywords


UFG Cu; ECAP; Fatigue; Stress- and strain-controlled loading

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Copyright (c) 2011 Lucie Navrátilová, Karel Obrtlík, Ludvík Kunz

License URL: http://creativecommons.org/licenses/by-nc-nd/3.0/

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